Product Catalog

High-conductivity silicone gap pad with strong compressibility and low mounting stress — the workhorse for device-to-heatsink interfaces.

• 2–15 W/m·K
• 0.3–10 mm
• Shore 00 20–80
• UL94 V-0

Ultra-low hardness, high-compression pad that seats under very light pressure (<5 psi) — protects stress-sensitive, uneven or fragile components.

• 2–10 W/m·K
• Shore 00 ~30
• 30–60% compression

Ultra-low siloxane volatility to prevent outgassing contamination of optics, sensors and high-reliability circuits.

• 4–15 W/m·K
• TML / CVCM (E595)
• ΣD3–D10 <100 ppm

Silicone-coated fabric carrier adds outstanding tear and puncture resistance with high dielectric strength.

• 1.5–4 W/m·K
• 10 KV/mm
• 0.3–10 mm

Fiberglass carrier enables ultra-thin, high-insulation, high-reliability construction with good compression rebound.

• 1.5–8 W/m·K
• 0.2–10 mm
• UL94 V-0

Polyimide-film composite delivering high dielectric strength and tear resistance for high-voltage power modules.

• 1.5–4 W/m·K
• >6 kV/mm
• Tensile >6 MPa

Fiberglass-based insulator combining efficient thermal transfer with a high dielectric withstand for LED, IGBT and MOSFET.

• 1.5–3 W/m·K
• Shore A 80
• 0.23 / 0.3 mm

Zero-siloxane, low-oil-bleed pad — a drop-in upgrade for silicone pads in contamination-sensitive systems.

• 3–6 W/m·K
• Non-silicone
• -40~125 °C

Solid film that softens at 45–60 °C to flow into microscopic surface gaps, delivering ultra-low thermal resistance.

• 3–8 W/m·K
• 0.15–0.5 mm
• Phase change ~50 °C

Non-curing, thixotropic metal-oxide grease for stable, low-resistance die and heatsink interfaces.

• 0.8–6 W/m·K
• Non-curing
• -40~150 °C

Dispensable, low-stress gel that cures to a pad-like elastomer — ideal for high-throughput automated dispensing.

• 1.5–8 W/m·K
• Dispensable
• -40~200 °C

Reaction-cured soft elastomer that fills large, irregular 0.5–10 mm gaps with zero installation stress.

• 2–8 W/m·K
• 1:1 mix
• Fills up to 10 mm

Two-part structural bond and thermal path in one — available in silicone, epoxy and polyurethane chemistries.

• 1.5 W/m·K
• 16 kV/mm
• Structural bond

Pourable potting that fully encapsulates assemblies for thermal transfer plus moisture, dust and vibration protection.

• 0.5–5 W/m·K
• Encapsulation
• Dielectric

Flexible metallized fabric for wrapping conductive foam and shielding sensitive components.

• 20–80 µm
• ≤60 Ω/□
• ≥75 dB @10 GHz

Black-coated copper foil with conductive pressure-sensitive adhesive for screens, gaskets and PCB grounding — also aids heat spreading.

• 6–50 µm
• ≤60 Ω/□
• ≥75 dB @10 GHz

Very high in-plane conductivity heat spreader for thin, high-heat-flux devices; flexible and easy to die-cut.

• Up to 1800 W/m·K
• 0.013–0.2 mm
• Flexible

Flexible natural-graphite film for cost-effective lateral heat spreading in consumer electronics.

• ~500 W/m·K
• 0.1–0.2 mm
• Flexible